The hot melt glue pen is designed for solvent-free bonding, such as bonding paper, cardboard, cork, wood, leather, textiles, foam material, plastic (except for PE, PP, PTFE, Styropor®, and soft PVC materials), ceramics, porcelain, glass, and stone. The material to be bonded must be clean, dry, and free of grease. The hot melt glue pen is suitable for gluing, repairing, decorating, and modeling. The hot melt glue pen is not suitable for bonding objects that may be exposed to temperatures of 50 °C or higher.